Chip Component : 0201~ 25mm Chip component
Fine Pitch Connector , QFPs , BGAs : 0.4mm Pitch
Micro BGA & CSP : 0.4 & 0.5 mm pitch
PCB Size : 50 X 50 ~ 460 X 510mm
Re-Flow : Lead Free Process
BGA Inspection : X-Ray & Rework

 
 
 
 
Manual Insertion : Axial , Radial , Riveting
Wave soldering : Clean , No-Clean , Lead Free
Washing Process : Aqueous Cleaning
Punching : Rigid / Flex PCB or Metal
 
 
 
 
ICT : Open / Short / Wrong Component Checking
FCT : Function Checking
Programming : Software Downloading & Programming
Burn In : Temperature Cycling Test
 
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